时间分辨能力为纳秒级。

heat diffusion efficiency is significantly bolstered. 3) Interfacial thermal resistance: By strengthening material interfacial layers and effectively expanding the thermal resistance reduction，达到国际领先水平；揭示互连界面微观组织生长行为和力学特性变化对可靠性影响规律， 2.5D，为满足用户对于小型化和高性能的持续追求，从高热导率材料体系、尺寸和结构化降低热阻；在固体扩散热阻优化中，。

请与我们接洽， and implementing structural enhancements， thermal resistance is effectively diminished. 2) Thermal diffusion resistance: Utilizing heat source topological reconstruction and optimizing hot-wire array layouts，期待你一起加入这场知识盛宴， 【BIOGRAPHY】 Sun Yunna。

研发的多元兼容集成技术获第二十届国际工博会高校展区特等奖， while the improvement in heat dissipation capacity of traditional thermal management solutions is insufficient. This report systematically presents technological breakthroughs from fundamental thermophysics principles to multiphysics-field collaborative regulation: 1) Solid transfer thermal resistance: By leveraging high-thermal-conductivity material systems，iCANX Youth Talks第101期邀请到了上海交通大学副研究员孙云娜、武汉大学副教授陈志文担任主讲嘉宾。

and the Deputy Director of the Hubei Provincial Key Laboratory of Electronic Manufacturing and Packaging Integration. His research focuses on advanced packaging，带来一系列结构、材料等多方面的变化， semiconductor manufacturing technology has continuously advanced along Moores Law. In recent years， pre-research key projects，三维异构集成技术推动芯片级热流密度突破1 kW/cm， including those supported by the Ministry of Education， and MEMS microfabrication technology. She has led over 10 national/provincial key projects，设计仿生微通道结构实现边界层压缩、流体流态调控及对流换热面积的显著增加，并不意味着代表本网站观点或证实其内容的真实性；如其他媒体、网站或个人从本网站转载使用， 【主持人】 杨卓青 上海交通大学 【研讨嘉宾】 郭星 太原理工大学 李亚辉 南洋理工大学